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The Boao Forum for Asia held a press conference for its 2026 annual conference. Secretary General Zhang Jun introduced the conference agenda, emphasizing the promotion of Asian economic integration and international cooperation. The forum also released two flagship reports, continuing the tradition of publishing reports at its annual conferences.

People Finance News, March 25 — Fujian local stocks surged in the short term, with Pingtan Development and Min Dong Power both hitting daily limits, Strait Innovation rising over 14%, and Road and Bridge Information, Zhangzhou Development, Fujian Jinsen, Dongbai Group, and Fujian Cement following suit with gains.

Huachuang Electronics released the 12-inch D2W hybrid bonding equipment Qomola HPD30, focusing on SoC, HBM, and Chiplet applications. The equipment breakthrough multiple core technologies and became the first domestic manufacturer to complete customer process verification, marking significant progress in 3D integration hybrid bonding equipment.

People's Finance News March 25 — On March 25, at the Boao Forum for Asia 2026 Annual Conference, Shen Dou, Executive Vice President of Baidu Group and President of Baidu Intelligent Cloud Business Group, stated that embodied AI currently faces bottlenecks at three levels: hardware bodies, data, and models that need to be overcome. China possesses the most complete supply chain ecosystem, the largest scale of engineering talent dividends, globally leading cost control capabilities, and abundant market demand. In the future, costs will decrease significantly, enabling China to be the first to establish embodied AI as a standard industrial product category. Shen Dou also noted that in the future, robot costs will drop substantially, and pricing may also be calculated on a token-based model.

People's Finance News, March 25 — The Shenzhen Municipal Bureau of Industry and Information Technology recently issued the "Shenzhen Action Plan to Accelerate High-Quality Development of the Artificial Intelligence Server Industry Chain (2026-2028)," which proposes supporting research and development and application of storage chips, accelerating advanced packaging technology breakthroughs for storage chips, with a focus on developing high-end storage products such as enterprise-grade SSDs and enterprise-grade memory modules; strengthening research and development of emerging technologies such as near-memory packaging and computing-storage integration to enhance high-end storage supply capacity, and building a high-end storage product supply system tailored for large model training and supercomputing centers.

People's Financial News, March 25 — Recently, Honor officially reached a strategic partnership with the Uzbekistan National Football Team, becoming the official strategic cooperation brand for the 2026 Uzbekistan National Team. It is understood that as a core hub in the Central Asian market, Uzbekistan's young consumer base is growing rapidly and has become a "strategic granary" for Honor's overseas growth. This move is an important initiative for Honor to increase investment in the Central Asian core market layout and accelerate its brand youth and premium positioning strategy.