Northern Huachuang Releases 12-inch Qomola HPD30 Hybrid Bonding Equipment

MetaMuskRat · 2026-03-25T06:36:33+00:00

Huachuang Electronics released the 12-inch D2W hybrid bonding equipment Qomola HPD30, focusing on SoC, HBM, and Chiplet applications. The equipment breakthrough multiple core technologies and became the first domestic manufacturer to complete customer process verification, marking significant progress in 3D integration hybrid bonding equipment.

MetaMuskRat

2026-03-25 06:36:33

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People’s Financial News, March 25 — North Microelectronics recently announced the Qomola HPD30, a 12-inch chip-to-wafer (Die to wafer, D2W) hybrid bonding equipment. This device focuses on the extreme requirements of chip interconnection across the entire 3D integration field, including SoC, HBM, Chiplet, and more. It overcomes multiple core technologies such as high-speed multi-axis coordinated control, nanoscale image recognition, global coordinate precise positioning, multi-specification chip self-adaptation, AI real-time perception, and intelligent compensation. The company has become the first domestic manufacturer to complete client process verification for D2W hybrid bonding equipment. This launch marks an important milestone for North Microelectronics in entering the 3D integration hybrid bonding equipment field.

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