TSMC Accelerates CoPoS Development, Targets Mass Production by End of 2028; Glass Substrate After 2030

According to TrendForce, TSMC is accelerating its CoPoS (Chiplet on Panel-level Substrate) development on June 17, with the 310×310 mm panel format now standardized. The company targets 2026 as a critical verification period for equipment and materials suppliers, 2027 for pilot production, and end of 2028 for mass production.

TSMC's next focus is expected to shift toward glass core substrates, with commercial-scale production targeted for 2030 or later.

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