SK Hynix Ships 12-Layer HBM4E Samples with 48GB Capacity and 16Gbps Speed

According to SK hynix, the company has supplied 12-layer samples of its new HBM4E high-bandwidth memory to customers. The 12-layer product delivers 48GB of capacity and up to 16 gigabits per second (Gbps) per pin, with more than 20% better energy efficiency than HBM4. SK hynix introduced its mass reflow molded underfill process, which improves structural stability and cuts thermal resistance by about 17% as it works toward mass production.

SK hynix held a 62% share of global HBM shipments in the second quarter of 2025. Nvidia has certified three memory suppliers for HBM4 for its Vera Rubin platform, with initial system shipments expected later in 2026.