Intel announced today that it has appointed Seok-Hee Lee as Executive Vice President of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In the role, Lee will lead all advanced packaging, systems integration, backend technology development, and backend manufacturing operations.
The appointment reflects Intel's strategy to position advanced packaging as a core business with dedicated leadership. As advanced packaging becomes increasingly critical to AI system performance, energy efficiency, and heterogeneous integration, the company aims to strengthen its ability to deliver differentiated system-level innovations for customers.